- Fiber laser marking >
- 20W fiber laser marking machine
- 30W Fiber Laser marking machine
- 50W Fiber Laser marking machine
- Ultraviolet laser marking >
- 3W UV Laser Marking machine
- 5W UV Laser Marking machine
- 10W UV Laser Marking machine
5W UV Laser Marking machine Description
5W UV Laser marking machine belongs to the laser marking machine series products, but its use 355 nm ultraviolet laser research and development, and it USES of third-order intracavity frequency doubling technique compared to the infrared laser. 355nm ultraviolet light is focused on the spot is very small. It can largely reduce the material and processing of mechanical deformation heat effect is small. Because it is mainly used for super fine marking, engraving, especially suitable for used in food, medicine packaging material marking, microporous, glass material of high speed divided and complex graphics on silicon wafer cutting and application field.
The charateristics of 5W UV Laser marking machine
1. Due to the extremely small focusing spot and small heat-affected area of processing. the ultraviolet laser can carry out ultra-fine marking, which is the primary product for customers with higher requirements for marking effect.
2. In addition to copper materials, UV laser is more suitable for processing of a wide range of materials.
3. Not only the beam quality is good, the focusing spot is smaller, also the ultra-fine marking can be achieved.
4. Wider application; The heat-affected area is very small, and will not produce thermal effect, and will not produce material burning problem.
5. Fast marking speed and high efficiency; Stable performance, small size, low power consumption.
Application of 5W UV Laser marking machine
1. Suitable for surface marking and micromachining of glass, polymer materials, etc.
2. Widely used for marking on the surface of packaging bottles (boxes) of food, drugs, cosmetics, wires and other polymer materials.
3. Flexible PCB board, LCD, TFT marking, chip cutting, etc.
4. Removal of metallic or non-metallic coating.
5. Microhole and blind hole processing of silicon wafer.